DSCSY

Technology Semiconductor Equipment & Materials

Disco Corporation

$39.73
+1.78 +4.69% today

Price History

Not enough data

Key Stats

Market Cap
43.09B
Avg Volume
280,850
P/E (TTM)
47.87
EPS
$0.83
52W High
$58.00
52W Low
$26.33
Div. Yield
1330.7%

Valuation

P/B Ratio
11.69
P/S Ratio
0.09
EV/EBITDA
-1.12
EV/Revenue
-0.52
PEG Ratio
1.87

Margins

Gross Margin 70.8%
Operating Margin 42.7%
Net Margin 31.6%
EBITDA Margin 46.4%

Growth & Returns

Revenue Growth (YoY)
27.1%
Earnings Growth (YoY)
43.5%
Earnings Growth (QoQ)
44.0%
Return on Equity
27.4%
Return on Assets
18.1%

Liquidity & Leverage

Current Ratio
3.00
Quick Ratio
2.04
Total Cash
283.89B
Total Debt
0

About

Disco Corporation manufactures and sells precision cutting, grinding, and polishing machines in Japan and internationally. The company offers precision machines include dicing saws, laser saws, grinders, polishers, wafer mounters, die separators, inspection systems, surface planers, and waterjet saws. It also provides precision processing tools, such as dicing blades, grinding wheels, and dry polishing wheels; and other products, such as accessory equipment, cut-off wheels, and related products. In addition, the company is involved in the maintenance, disassembly, and recycling of precision cutting, grinding, and polishing machines, as well as provides training services for the maintenance and operation of its machines. Further, it leases precision machines; and purchases and sells used machines. Additionally, the company manufactures and sells precision diamond abrasive tools; and offers chargeable processing services. Disco Corporation was founded in 1937 and is based in Ota, Japan.

www.disco.co.jp